Enterprise AI Analysis
Low-Loss, Multi-Reticle-Stitched SiN Waveguides for 300 mm Wafer-Level Optical Interconnects
This breakthrough technology introduces wafer-level optical interconnects tailored for future AI/ML compute clusters. By enabling massive, efficient data interconnects across 300 mm wafers with extremely low propagation and stitch loss, it promises unparalleled data bandwidth, energy efficiency, and significantly reduced latency for multi-processor-unit systems.
Executive Impact: Revolutionizing Wafer-Scale AI Compute
This innovation unlocks new possibilities for AI/ML infrastructure, addressing critical bottlenecks in data transfer and processing at an unprecedented scale. By enabling efficient, low-loss optical pathways directly on a 300 mm wafer, we can support the next generation of high-performance computing.
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Propagation Loss @ 1310nm
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SiN Waveguide Stitch Loss
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Wafer Scale Deployment
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Max Waveguide Length
Deep Analysis & Enterprise Applications
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High-Precision Reticle Stitching: A Paradigm Shift
Achieving ~10 nm level precision in reticle stitching is critical for enabling next-generation wafer-level optical I/O, surpassing the limitations of traditional 100 nm approaches.
| Feature | ~100 nm Level Precision Reticle Stitching | ~10 nm Level Precision Reticle Stitching |
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| Basic Info |
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| Waveguide Suitability |
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| Prospects |
Reticle stitching suitable for lower-confinement waveguides, where typical reticle offsets of ~100 nm introduce negligible issues. |
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End-to-End Wafer-Scale SiN Waveguide Fabrication Flow
The fabrication process leverages advanced 300 mm CMOS pilot lines and 193 nm immersion lithography to create complex, multi-reticle-stitched SiN waveguide networks.
2.7 µm BOX Deposition
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300/400 nm LPCVD SiN Deposition
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193 nm Immersion Lithography
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SiN Patterning
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Oxide Top Cladding
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Planarization
<0.002
dB SiN Waveguide Stitch Loss Achieved
Achieving Negligible Stitch Loss
Through advanced lithography and careful process control, the reticle-to-reticle offset was minimized to less than 5 nm, resulting in almost imperceptible stitch losses, which is critical for long-distance optical interconnects.
Impact of Increased Reticle Offset
To understand the robustness of the SiN waveguides, a deliberate 20 nm y-offset was introduced. This resulted in a slight but measurable increase in stitch loss, validating the importance of ultra-high precision for critical applications. Wider taper-up stitches were shown to mitigate this increase.
Key Takeaway: Increased offset (20 nm) raised stitch loss to 0.002-0.005 dB, highlighting the value of sub-5 nm precision. Wider taper-up stitches (2.5 µm) demonstrated ~0.001 dB lower loss than 1.8 µm for improved robustness.
Future of AI/ML Interconnects: Wafer-Scale Optics
Wafer-level optical interconnects are set to redefine the architecture of AI/ML compute clusters by providing unparalleled bandwidth, energy efficiency, and low latency over tens of centimeters. This technology directly addresses the challenges posed by the growing demand for high-performance data interconnects between XPUs and HBMs on a single 300 mm wafer, enabling more powerful and efficient AI systems.
Calculate Your Potential AI Integration ROI
Estimate the significant efficiency gains and cost savings your enterprise could realize by integrating advanced AI solutions like wafer-level optical interconnects.
Annual Cost Savings
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Annual Hours Reclaimed
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Your AI Implementation Roadmap
A structured approach to integrating wafer-level optical interconnects ensures successful deployment and maximizes your return on investment. Our expert team guides you through each phase.
Phase 1: Discovery & Strategy
Comprehensive assessment of your current infrastructure, data flow, and AI/ML workloads. Define key performance indicators (KPIs) and tailor a strategic roadmap for optical interconnect integration.
Phase 2: Design & Prototyping
Detailed design of wafer-level optical interconnect layouts, including waveguide routing, placement of XPUs/HBMs, and integration points. Develop and test prototypes to validate performance and compatibility.
Phase 3: Fabrication & Integration
Leverage advanced 300 mm CMOS processes for SiN waveguide fabrication with high-precision reticle stitching. Integrate optical interconnects with your compute and memory units.
Phase 4: Validation & Optimization
Rigorous testing of the integrated optical system, including propagation loss, stitch loss, bandwidth, and latency. Optimize for maximum performance and efficiency in real-world AI/ML environments.
Phase 5: Scaled Deployment & Support
Roll out the optical interconnect solution across your wafer-scale compute clusters. Provide ongoing support, maintenance, and performance monitoring to ensure long-term success and scalability.
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