Photonics Integration & Quantum Tech
Towards fibre-like loss for photonic integration from violet to near-infrared
This article presents a groundbreaking ultralow-loss photonic integrated circuit (PIC) platform based on germano-silicate, achieving resonator Q factors over 180 million from violet to telecom wavelengths. It demonstrates record-low waveguide losses, up to 13 dB lower in the violet band than current platforms, and achieves fibre-like loss levels (0.08 dB/m at 1064 nm) without thermal annealing. The platform supports dispersion engineering for soliton microcombs, acoustic mode confinement for stimulated Brillouin lasing, and large-mode-area-induced thermal stability for low-frequency-noise self-injection locking. This innovation bridges ultralow-loss PIC technology to critical applications like optical clocks, precision navigation, and quantum sensors, promising a 20-dB improvement in waveguide loss over existing high-performance platforms.
Executive Impact & Key Advantages
The breakthrough germano-silicate PIC platform offers unparalleled performance metrics, paving the way for next-generation photonic applications in quantum computing, sensing, and communication.
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Max Resonator Q Factor
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Violet Band Loss Reduction
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Lowest Waveguide Loss
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Q Factor Improvement (No Annealing)
Deep Analysis & Enterprise Applications
Select a topic to dive deeper, then explore the specific findings from the research, rebuilt as interactive, enterprise-focused modules.
463M
Peak Intrinsic Q Factor Achieved at 1064nm. This represents a new benchmark in ultralow-loss photonic integration, critical for high-performance applications.
Enterprise Process Flow
PECVD Germano-silicate Layer Deposition
→
Ru & Silica Hard Mask Deposition
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DUV Lithography & Dry Etch
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Fluorine Etch & Hard Mask Removal
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Standard Furnace Anneal
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Silica Cladding Deposition
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Annealed Germano-silicate PIC
| Platform | Key Advantages | Lowest Loss (dB/m) |
|---|---|---|
| Ge-silica (This Work) |
|
0.08 dB/m @ 1064nm |
| ULL Si3N4 |
|
0.19 dB/m @ 965nm |
| LiNbO3 |
|
1.0 dB/m @ 965nm |
Real-world Impact: Ultralow-Loss PICs for Quantum Sensors
The demonstrated germano-silicate platform provides the foundational low-loss performance required for next-generation quantum sensors. By reducing waveguide losses to near fibre-like levels, the system noise is drastically lowered, enhancing signal integrity and extending coherence times. This enables more precise measurements for applications such as atomic clocks, precision navigation systems, and quantum computing leveraging integrated photonics. The CMOS-compatible process further allows for scalable manufacturing and integration with existing electronics, accelerating deployment in critical infrastructure.
Calculate Your Potential ROI
Estimate the efficiency gains and cost savings for your enterprise by implementing advanced photonic solutions.
Estimated Annual Savings
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Hours Reclaimed Annually
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Implementation Timeline & Roadmap
A phased approach to integrate cutting-edge photonic solutions into your enterprise.
Phase 1: Proof of Concept & Design
Duration: 3-6 Months
Tailored design of germano-silicate PICs for specific application requirements, including dispersion and mode confinement optimization. Fabrication of initial prototypes.
Phase 2: Advanced Prototyping & Integration
Duration: 6-12 Months
Integration with active components (lasers, modulators) and testing for full system functionality. Validation of performance benchmarks (Q-factor, loss, noise).
Phase 3: Scalable Manufacturing & Deployment
Duration: 12-18 Months
Transition to CMOS-foundry-compatible mass production. Development of packaging solutions and initial deployment in target systems like quantum sensors or optical clocks.
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